Assembly Yield Prediction of Plastically Encapsulated Packages with a Large Number of Manufacturing Variables by Advanced Approximate Integration Method

Hsiu-Ping Wei, Bongtae Han*, Byeng D. Youn, Hyuk Shin, Ilho Kim, and Hojeong Moon Microelectronics Reliability, SCIE (IF: 1.9, Rank: 61.6%), 2017-11, Vol 78, pp. 319-330

A Newly Formulated Resilience Measure that Considers False Alarms

Joung Taek Yoon, Byeng D. Youn*, Minji Yoo, and Yunhan Kim Reliability Engineering & System Safety, SCIE (IF: 11.0, Rank: 1.4%), 2017-11, Vol. 167, pp. 417-427

Modeling and Assessment of Partially Debonded Piezoelectric Sensor in Smart Composite Laminates

Asif Khan, Heung Soo Kim*, Byeng D. Youn International Journal of Mechanical Sciences, SCIE (IF: 9.4, Rank: 2.5%), 2017-10, Vol 131-132, pp. 26-36

Omnidirectional Regeneration (ODR) of Proximity Sensor Signals for Robust Diagnosis of Journal Bearing Systems

Joon Ha Jung, Byung Chul Jeon, Byeng D. Youn*, Myungyon Kim, Donghwan Kim, and Yeonwhan Kim Mechanical Systems and Signal Processing, SCIE (IF: 8.9, Rank: 3.0%), 2017-06, Vol. 90, pp. 189–207

Classification of Operating Conditions of Wind Turbines for a Class-wise Condition Monitoring Strategy

Jong M. Ha, Hyunseok Oh*, Jungho Park, and Byeng D. Youn* Renewable Energy, SCIE (IF: 9.1, Rank: 17.2%), 2017-04, Vol. 103, pp. 594-605

Bivariate Lifetime Model for Organic Light-Emitting Diodes

Dae Whan Kim, Hyunseok Oh, Byeng D. Youn*, and Dongil Kwon IEEE Transactions on Industrial Electronics, SCIE (IF: 7.2, Rank: 4.4%), 2017-03, Vol. 64, No. 3, pp. 2325-2334