Assembly Yield Prediction of Plastically Encapsulated Packages with a Large Number of Manufacturing Variables by Advanced Approximate Integration Method

Hsiu-Ping Wei, Bongtae Han*, Byeng D. Youn, Hyuk Shin, Ilho Kim, and Hojeong Moon Microelectronics Reliability, 2017-11, SCIE (IF: 1.6, Rank: 67.8%) , Vol 78, pp. 319-330

A Newly Formulated Resilience Measure that Considers False Alarms

Joung Taek Yoon, Byeng D. Youn*, Minji Yoo, and Yunhan Kim Reliability Engineering & System Safety, 2017-11, SCIE (IF: 9.4, Rank: 3.3%) , Vol. 167, pp. 417-427

Modeling and Assessment of Partially Debonded Piezoelectric Sensor in Smart Composite Laminates

Asif Khan, Heung Soo Kim*, Byeng D. Youn International Journal of Mechanical Sciences, 2017-10, SCIE (IF: 7.1, Rank: 2.6%) , Vol 131-132, pp. 26-36

Omnidirectional Regeneration (ODR) of Proximity Sensor Signals for Robust Diagnosis of Journal Bearing Systems

Joon Ha Jung, Byung Chul Jeon, Byeng D. Youn*, Myungyon Kim, Donghwan Kim, and Yeonwhan Kim Mechanical Systems and Signal Processing, 2017-06, SCIE (IF: 7.9, Rank: 2.5%) , Vol. 90, pp. 189–207

Classification of Operating Conditions of Wind Turbines for a Class-wise Condition Monitoring Strategy

Jong M. Ha, Hyunseok Oh*, Jungho Park, and Byeng D. Youn* Renewable Energy, 2017-04, SCIE (IF: 9.0, Rank: 13.8%) , Vol. 103, pp. 594-605

Bivariate Lifetime Model for Organic Light-Emitting Diodes

Dae Whan Kim, Hyunseok Oh, Byeng D. Youn*, and Dongil Kwon IEEE Transactions on Industrial Electronics, 2017-03, SCIE (IF: 7.5, Rank: 0.2%) , Vol. 64, No. 3, pp. 2325-2334