Forward-Stepwise Regression Analysis for Fine Leak Batch Testing of Wafer-level Hermetic MEMS Packages
Changsoo Jang, Byeng D. Youn, Ping F. Wang, Bongtae Han*, and Suk-Jin Ham
Microelectronics Reliability, SCIE (IF: 2.5, Rank: 55.1%), 2010-4, Vol. 50, pp. 507-513