Forward-Stepwise Regression Analysis for Fine Leak Batch Testing of Wafer-level Hermetic MEMS Packages
Changsoo Jang, Byeng D. Youn, Ping F. Wang, Bongtae Han*, and Suk-Jin Ham
Microelectronics Reliability,
2010-4, SCIE (IF: 1.6, Rank: 67.8%) , Vol. 50, pp. 507-513