Fine Leak Batch Testing of Multiple MEMS Packages > International | 서울대학교 초자율화 인공지능 연구실

Publication

Hyperautomation Artificial Intelligence

Fine Leak Batch Testing of Multiple MEMS Packages

본문

Conference: SPIE 2009 Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII

Author: Changsoo Jang, Byeng D. Youn, Suk-Jin Ham, and Bongtae Han

Date: 2009-01-24

Presentation Type: Oral

목록

이전글A Generic Bayesian Framework for Decision-Centered Lifetime and Reliability Prognostics 08.10.05
다음글A Generic Bayesian Framework for Real-Time Prognostics and Health Management (PHM) 09.05.04